The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2003
Filed:
Jul. 31, 2001
Applicant:
Inventors:
Shigeo Nakamura, Odawara, JP;
Kousaku Wakatsuki, Odawara, JP;
Haruhide Takahashi, Odawara, JP;
Hitoshi Shindo, Odawara, JP;
Hiromitsu Masuda, Odawara, JP;
Mikio Tokuyama, Tsukuba, JP;
Toshihiko Shimizu, Yasato, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 ;
U.S. Cl.
CPC ...
G11B 5/48 ;
Abstract
To restrain temperature rise by controlling heat radiation from an IC. More specifically, an area of junctioning pads which are in contact with an IC is enlarged to substantially overlap the whole or at least half or more of the area of the IC. Further, the IC is covered with an overcoat which protrudes to other parts of a head supporting mechanism.