The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2003
Filed:
Apr. 01, 2002
Applicant:
Inventor:
Yasufumi Uchida, Tokyo, JP;
Assignee:
Oki Electric Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A semiconductor device includes a substrate; a metal layer formed on the substrate; an insulating layer, which is formed on the metal layer and is provided with a via-hole through it; and a bonding pad formed above the via-hole. The bonding pad comprises an inner portion arranged in the via-hole and an outer portion arranged above the via-hole. The boding pad is made of a conductive resin having a shock absorbing characteristic.
Uchida, Yasufumi. (2003). Semiconductor device with shock absorbing bond pad (U.S. Patent No. 6614112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6614112
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile