The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2003
Filed:
May. 24, 2001
Stephen F. Corbin, Waterloo, Ontario, CA;
Douglas J. McIsaac, Waterloo, Ontario, CA;
Xin Qiao, Boise, ID (US);
Other;
Abstract
Variable melting point solders and brazes having compositions comprising a metal or metal alloy powder having a low melting point with a metal powder having a higher melting point. Upon heating, in-situ alloying occurs between the low and high melting point powders such that solidification occurs at the solder or braze temperature thus creating a new, higher solidus (or melting) temperature with little or no intermetallic formation. A solder comprising Sn powder mixed with a Sn—Bi eutectic powder having a composition of 63 wt % Sn:57 wt % Bi such that the bulk composition of the mixture is 3 wt % Bi has an initial melting point of 140° C. and a re-melt temperature of 220° C. after heating due to in-situ alloying. A composition of Pb powder mixed with a Pb—Sn eutectic powder having a composition of 62 wt % Sn:58 wt % Pb such that the bulk composition of the mixture is 15 wt % Sn has an initial melting point of 183° C. and a re-melt temperature of 250° C.