The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2003
Filed:
Nov. 20, 2000
Applicant:
Inventor:
Robert Peter Radloff, Corona, CA (US);
Assignee:
Handy & Harman (NY Corp.), Rye, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29B 4/414 ;
U.S. Cl.
CPC ...
B29B 4/414 ;
Abstract
A method and system for fabricating electronic packaging units which include a molded body and a plurality of electrically conductive leads protruding therefrom. The packaging units are made by overlaying lead frames having leads and then depositing molding material on the leads. The packaging units are manufactured in an assembly line process which includes a feeder to feed the lead frames and a molder to deposit the molding material.
Radloff, Robert. (2003). Method and system for manufacturing electronic packaging units (U.S. Patent No. 6612890). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6612890
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile