The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2003
Filed:
Sep. 06, 2000
Applicant:
Inventors:
Zhong-You (Joe) Shi, Ann Arbor, MI (US);
Lakhi N. Goenka, Ann Arbor, MI (US);
Andrew Z. Glevatsky, Plymouth, MI (US);
Assignee:
Visteon Global Tech., Inc., Dearborn, MI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 ;
U.S. Cl.
CPC ...
H05K 3/34 ;
Abstract
A method for forming connections within a multi-layer electronic circuit board . The method includes forming an aperture within the circuit board and selectively coating the interior surface of the aperture with a polar solder mask material that is effective to bond with solder that is selectively inserted into the aperture, thereby retaining the solder within the aperture and improving the electrical connection provided by the solder.