The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2003
Filed:
May. 01, 2000
Applicant:
Inventors:
Dai Sasaki, Tokyo, JP;
Tohru Terasaki, Aiichi, JP;
Masuo Kato, Aiichi, JP;
Masami Tsurumi, Aiichi, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 ;
U.S. Cl.
CPC ...
H05K 3/32 ;
Abstract
A semiconductor device with bump electrodes having acutely shaped tips and method of mounting same. The bump electrodes are brought into contact with respective portions of a conductive pattern of a mounting substrate without any foreign matter between the tips of the bump electrodes and the respective portions of the conductive pattern. Thereafter, sealing material is allowed to surround the bump electrodes.
Sasaki, Dai. (2003). Method of mounting a device to a mounting substrate (U.S. Patent No. 6612024). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6612024
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile