The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2003
Filed:
Apr. 05, 2001
Applicant:
Inventors:
Takashi Kousaka, Tsukuba, JP;
Naoya Suzuki, Tsukuba, JP;
Toshiaki Tanaka, Tsukuba, JP;
Masaaki Yasuda, Tsukuba, JP;
Aizou Kaneda, Yokohama, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/329 ; H01L 2/328 ; H01L 2/312 ;
U.S. Cl.
CPC ...
H01L 2/329 ; H01L 2/328 ; H01L 2/312 ;
Abstract
In the present invention, provided are a semiconductor device having a semiconductor-element-mounting substrate on which a semiconductor element has been mounted via an adhesive having an exothermic-reaction curing start temperature of 130° C. or below as measured with a differential scanning calorimeter at a heating rate of 10° C./minute, and a process for its fabrication.