The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2003
Filed:
Jun. 08, 2001
Hassan S. Hashemi, Laguna Niguel, CA (US);
Skyworks Solutions, Inc., Irvine, CA (US);
Abstract
One disclosed embodiment comprises a substrate having a top surface for receiving a semiconductor die with a number of solder bumps on its active surface. The disclosed embodiment further comprises a printed circuit board attached to a bottom surface of the substrate. Another disclosed embodiment comprises at least one via in the substrate. The at least one via provides an electrical and thermal connection between a signal pad of the die and the printed circuit board. The at least one via provides an electrical connection between a substrate signal pad and the printed circuit board. The substrate signal pad is connected to the signal pad of the die by a signal solder bump. The at least one via also provides an electrical connection between the signal pad of the die and a land that is electrically connected to the printed circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile