Easy threading wirecoating dies

Abstract

Dies which facilitate the threading of a strand are disclosed. Each die embodiment includes portions that move relative to each other to allow access to the area between the portions. One embodiment of a die embodying the principles of the invention includes an upper portion and a lower portion. Each die portion includes components corresponding to substantially half of a wirecoating die. Accordingly, when the die portions are adjacent each other, they form a complete wirecoating die. In the preferred embodiment, the upper portion is moveable relative to the lower portion, which is fixed. Each portion is coupled to a support by a conduit through which resin can be supplied to the particular die portion. The upper portion is pivotally mounted to the support for movement between an upper position in which the die is open and a lower position in which the die is closed. This die is used in an in-line wirecoating process in which a strand is wirecoated downstream from a bushing during a fiber forming process. Another embodiment of a die embodying the principles of the invention is a sealable-slot die. This die embodiment includes a body and a nozzle disposed in the body. The nozzle and the die body have slots which are in fluidic communication with the exterior of the die. The slots are sized to permit a strand to be thread through them and into the interior of the nozzle. A plate with an extension is placed on the die so that the extension seals the slots after a strand is thread in the die. This die is typically used in a low pressure system, such as a string binder wirecoating process.