The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2003
Filed:
Jun. 26, 2002
Applicant:
Inventors:
Masaru Sato, Yokohama, JP;
Hiroyuki Kitada, Tokyo, JP;
Assignee:
Yamaichi Electronics Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/315 ;
U.S. Cl.
CPC ...
H01R 1/315 ;
Abstract
A semiconductor device-socket is provided, in which the amount of the movement of a contact deviation member is restricted by a protrusion P such that a predetermined gap CL is formed between a partition wall W and a movable contact portion A , and a predetermined gap CL is also formed between an outer peripheral surface of the partition wall W and a movable contact portion A