The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2003
Filed:
Aug. 20, 1999
Applicant:
Inventors:
Masahiko Inoue, Tokyo, JP;
Hiroshi Ikeda, Kanagawa, JP;
Assignee:
NEC Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 9/00 ;
U.S. Cl.
CPC ...
G06K 9/00 ;
Abstract
A bump inspecting apparatus lights a spherical solder bump mounted on the surface of a circuit board and has a reinforcing resin applied to the lower half thereof from all circumferential directions with rays of light which intersect at a predetermined angle. An image of the lighted solder bump is captured while the amount of light irradiated upon the central portion of a solder bump is reduced. An object is extracted from image data obtained by the image capture and the area and/or the aspect ratio of the object are confirmed. The quality of the state of the reinforcing resin applied to the solder bump can be inspected.