The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2003
Filed:
Aug. 03, 2001
Applicant:
Inventor:
Seiya Isozaki, Tokyo, JP;
Assignee:
Nec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 2/352 ;
Abstract
A semiconductor device includes a bonding-structure for electrically and mechanically bonding a solder ball to the electrode pad. The bonding-structure includes flexible arms that are connected to a common supporting layer that allows a relative displacement of the solder ball in relation to the semiconductor chip. The arms extending in one direction are supported by one supporting layer and the arms extending in an opposite direction are supported by another supporting layer.
Isozaki, Seiya. (2003). Semiconductor device and method of forming the same (U.S. Patent No. 6608384). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6608384
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile