The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2003

Filed:

May. 17, 2001
Applicant:
Inventors:

I-Ming Liu, Hsinchu, TW;

Chin-Chen Yang, Hsinchu Hsien, TW;

Hong-Shiung Chen, Hsinchu, TW;

Assignee:

AU Optronics Corporation, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/940 ;
Abstract

A plurality of metal bumps connecting a nonconducting substrate and a chip, consisting of: at least a first metal bump having at least one curved face, at least a second metal bump having at least one curved face, and at least a third metal bump having at least a first curved face and a second curved face. The three centers of these first three metal bumps form a triangle, in that the first curved face of the third metal bump is adjacent to the curved face of the first metal bump, and the second curved face of the third metal bump is adjacent to the curved face of the second metal bump.


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