The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2003
Filed:
Oct. 25, 2002
Applicant:
Inventor:
Katsumi Yamamoto, Shanghai, CN;
Assignee:
Hua Wei Semiconductor (Shanghai) Co., Ltd., Shanghai, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/714 ; H01L 3/100 ;
U.S. Cl.
CPC ...
H01L 2/714 ; H01L 3/100 ;
Abstract
An image sensor die formed on a wafer is disclosed. The image sensor die comprises a plurality of pixels formed in a semiconductor substrate, each pixel including a light sensitive element. Further, a dummy pattern is formed on the image sensor die, wherein the dummy pattern comprises ridges of a dummy pattern material that is operative to evenly distribute a micro-lens material over said wafer.