The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2003
Filed:
Oct. 27, 2000
Makoto Okubo, Wakayama, JP;
Kazuhiko Kiuchi, Wakayama, JP;
Ryoichi Hashimoto, Wakayama, JP;
Takayuki Nomura, Wakayama, JP;
Masahiro Mori, Wakayama, JP;
Kenichi Miyamoto, Wakayama, JP;
Kao Corporation, Tokyo, JP;
Abstract
Process for producing a molded article comprising pouring or injecting a liquid molding material into a mold in the presence of a surface-treating agent comprising a contact angle-reducing substance under the condition that the contact angle between the liquid molding material and the inner surface of the mold is not more than 30°, and curing the liquid molding material; surface-treating agent comprising a contact angle-reducing substance which reduces the contact angle between the liquid molding material and a flat plate made of the same material as the mold to not more than 30°; method for reducing surface voids during molding, comprising using the above surface-treating agent; and use of the above surface-treating agent for reducing surface voids. The molded article has a shape accurately corresponding to the shape of an inner surface of a mold.