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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6607116 B1

PDFFull Text
Expired
Date of Patent:
Aug. 19, 2003

Filed:

Jun. 06, 2001

Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering

Applicant:
Inventors:

Kenichiro Suetsugu, Nishinomiya, JP;

Shunji Hibino, Hirakata, JP;

Yukio Maeda, Hirakata, JP;

Shoshi Kabashima, Hirakata, JP;

Mikiya Nakata, Suita, JP;

Assignee:

Matsushita Electric Industrial Co., Ltd., Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Tom Dunn

Assistant Examiner:

Kiley Stoner

Int. Cl.
CPC ...
B23K 3/102 ; B23K 3/700 ;
U.S. Cl.
CPC ...
B23K 3/102 ; B23K 3/700 ;
Abstract

There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained by utilizing a differential thermal analysis method, and thereby a quality of the lead-free solder material used for a flow soldering process is estimated based on the obtained differential thermal analysis curve.

Find Patent Forward Citations

Suetsugu, Kenichiro. (2003). Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering (U.S. Patent No. 6607116). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6607116

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