The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2003
Filed:
Aug. 02, 2001
Yasushi Toda, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
There is provided a wire bonding apparatus operated steadily at a high speed without excitation of vibrations of an XY stage and a capillary which are movable parts. The wire bonding apparatus is configured so as to have a composite target path generating section for generating a target path in which the deceleration part of a go path and the acceleration part of a return path are composed to one continuous path, for a path part of reciprocating movement of said target path indicating a motion process of either one or both of the XY stage and capillary.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile