Sealed test chamber for module ic handler

Abstract

The present invention relates to an improved chamber for a module IC handler including a pre-heater for heating module ICs to a set temperature. A receiving piece is installed in a heating chamber and is formed with a plurality of receiving grooves for receiving a carrier holding module ICs. An operating piece is disposed the chamber adjacent the receiving piece. An upper surface the operating piece includes a plurality of receiving grooves of the same interval as the receiving grooves of the receiving piece. In operation, the operating piece raises a module IC carrier from a first groove on the receiving piece and translates the module IC carrier by a distance roughly equivalent to the thickness of the module IC carrier. After translating the module IC carrier, the operating piece lowers the module IC carrier into an adjacent second groove on the receiving piece. By repeating this cycle, the operating piece moves a module IC carrier down the receiving piece, a groove at a time, while the module ICs are being heated, to a feeding means. The feeding means moves the module IC carrier to a test site. Shutters prevent heat from escaping the chamber while the module IC carriers move through the chamber.