The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2003
Filed:
May. 25, 2000
John A. Andresakis, Clifton Park, NY (US);
Oak-Mitsui, Inc., Hoosick Falls, NY (US);
Abstract
A process for forming printed circuit substrates incorporating impedance elements in which a pattern of impedance elements and a conductor pattern are incorporated on an insulating support. The process involves depositing a layer of an impedance material on a first surface of a sheet of an electrically highly conductive material and attaching a second surface of the sheet of highly conductive material to a support. Then one applies a layer of a photoresist material onto the layer of impedance material with imagewise exposure and development. After etching away the portion of the impedance layer material underlying the removed nonimage areas of the photoresist material, a pattern of impedance elements remain on the sheet of highly conductive material. Thus printed circuit board with impedance elements can be manufactured to a high degree of electrical tolerance.