The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2003
Filed:
Jul. 02, 2001
Applicant:
Inventor:
Yoshihiko Toyoda, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3544 ;
U.S. Cl.
CPC ...
H01L 2/3544 ;
Abstract
Chip element formation areas and scribe line areas dividing the chip formation areas are formed on a wafer. On each scribe line area, an interconnection surrounds each chip formation area, and extends to near an edge of a wafer. With this arrangement, it is possible to provide a semiconductor device and a manufacturing method which can reduce a difference in the depositing rate of plating between the center and the periphery of the wafer.