The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2003

Filed:

Jul. 23, 2001
Applicant:
Inventors:

Hiroshi Imai, Kariya, JP;

Hirokazu Itakura, Hazu-gun, JP;

Hiroyuki Ban, Hazu-gun, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 3/1058 ;
U.S. Cl.
CPC ...
H01L 3/1058 ;
Abstract

A semiconductor device has plural output circuits. Each of the plural output circuits has a semiconductor switching element and a heat protection circuit including a diode. When the heat protection circuit in a predetermined output circuit detects that heat emitted from the semiconductor switching element in the predetermined output circuit, the heat protection circuit turns off the semiconductor switching element in the predetermined output circuit. The plural output circuits are thermally isolated from each other by a trench and an insulation film. The trench and the insulation film prevent the heat from being transmitted from the predetermined output circuit to an adjacent output circuit. Therefore, even if the heat, by which the semiconductor switching element in the predetermined output circuit is turned off, is generated at the predetermined output circuit, the semiconductor switching element in the adjacent output circuit is not turned off by the heat.


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