The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2003
Filed:
Mar. 12, 2001
Applicant:
Inventor:
Michiyoshi Takano, Suwa, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A semiconductor device and a manufacturing method thereof are provided, wherein both bumps of a semiconductor chip and leads on a tape substrate can be accurately connected at the time of performing thermocompression bonding of the two using a heating tool. The film tape carrier and semiconductor chip expand due to heat applied from the heating tool of the gang bonding apparatus, so setting the pitch of the bumps and the pitch of the inner leads, taking into consideration beforehand the difference in linear expansion coefficient of the two at the time of gang bonding, solves the problem.