The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2003

Filed:

Oct. 11, 2001
Applicant:
Inventors:

Francis G. Celii, Dallas, TX (US);

Maureen A. Hanratty, Dallas, TX (US);

Katherine E. Violette, Dallas, TX (US);

Rick L. Wise, Plano, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/166 ;
U.S. Cl.
CPC ...
H01L 2/166 ;
Abstract

A method of determining the thickness of a thickness of a first layer of material in a semiconductor device using a reflectometer, the first layer of material being disposed outwardly from a second layer of material, the first and second layer of material both including silicon. The method includes generating at least one predicted behavior curve associated with a depth profile of an interface between the first and second layer of material, the predicted behavior curve including at least one expected optical measurement, the depth profile associated with the interface being present at a particular theoretical depth. The method also includes emitting light onto a surface of the semiconductor device. The method further includes collecting at least one optical measurement from portions of the emitted light that are reflected by the semiconductor device. The method additionally includes comparing the at least one optical measurement to the predicted behavior curve and determining the approximate actual depth of the interface in response to the compared optical measurement.


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