The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2003
Filed:
Nov. 16, 2000
Applicant:
Inventors:
Akira Nonomura, Tochigi-ken, JP;
Yasushi Yamada, Tochigi-ken, JP;
Hisao Sato, Tochigi-ken, JP;
Tokuo Tsuura, Tochigi-ken, JP;
Hiroaki Kobayashi, Tochigi-ken, JP;
Assignee:
Kao Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
D21H 2/504 ; D21J 1/00 ;
U.S. Cl.
CPC ...
D21H 2/504 ; D21J 1/00 ;
Abstract
A method of producing a pulp molded article comprising a papermaking step in which a pulp slurry is fed to the surface of a papermaking mold having suction paths, and water contained in the pulp slurry is sucked through the suction paths whereby the pulp is deposited on the surface to form a wet preform, and a dewatering step in which the wet preform is dewatered, wherein the temperature of the fed pulp slurry is raised while the pulp is being deposited on the surface.