The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2003
Filed:
Nov. 27, 2000
Applicant:
Inventors:
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 3/300 ; H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 3/300 ; H01L 2/348 ;
Abstract
A semiconductor device (A) includes a first lead ( ) to which a semiconductor chip ( ) is bonded, a second lead ( ) connected to the semiconductor chip ( ) via a wire (W), and a resin package ( ) sealing the semiconductor chip ( ) and the wire (W). Of the first and the second leads ( ), at least one of inner terminals ( ) enclosed in the resin package ( ) is bent in a direction of a thickness of the resin package ( ).
Quick Actions:
Sano, Masashi. (2003). Semiconductor device (U.S. Patent No. 6603148). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6603148
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