The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2003
Filed:
Oct. 05, 2001
Applicant:
Inventors:
Chak Yin Tang, Kowloon, HK;
Xiao-lin Xie, Wuhan, CN;
Assignee:
The Hong Kong Polytechnic University, Kowloon, HK;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 9/06 ;
U.S. Cl.
CPC ...
C08K 9/06 ;
Abstract
In-organic fillers are modified by in-situ co-polymerization of vinyl silane and another vinyl monomer. Vinyl silane couples with the filler by Si—O bonds. The remaining vinyl groups on the surface of the treated fillers then co-polymerize with the other vinyl monomer. The modified in-organic fillers treated by the in-situ co-polymerization are subsequently used to fill the polymer matrix. Tensile and impact strength of filler-reinforced polymer composites are improved remarkably.
Tang, Chak. (2003). In-situ co-polymerization process for preparing in-organic filler-reinforced polymer-matrix composites (U.S. Patent No. 6602933). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6602933
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile