The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2003
Filed:
Mar. 24, 2000
Makoto Matsuoka, Hatano, JP;
Hitoshi Odashima, Yokohama, JP;
Kazuyuki Futagi, Yokohama, JP;
Syoji Nakakuki, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In an apparatus for separating semiconductor chips, a semiconductor wafer stuck to an adhesive sheet with its silicon mirror surface facing downwards is sucked as a whole through its circuit surface side by means of a sucker plate capable of sucking the whole of wafer. In order to separate the sheet from a frame fixing the sheet while the sheet being sucked, the sheet is cut by a cutter edge so as to be separated from the frame. To separate the sheet from the wafer, the wafer top surface is guided by a guide plate having a tip angle of 15° and by causing the sheet to profile the tip of the guide plate, the sheet is peeled off in a direction making an angle of 45° to the dicing direction on the wafer.