The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2003
Filed:
Mar. 25, 2002
Kenji Sakai, Nagoya, JP;
Eisaku Inoue, Nagoya, JP;
Satoru Kurimoto, Nagoya, JP;
Koichi Yamamoto, Nagoya, JP;
Takayuki Shibayama, Nagoya, JP;
Daido Metal Company Ltd., Nagoya, JP;
Abstract
Disclosed is a composite sliding material having a steel plate and a sintered copper alloy layer which is bonded to the steel plate. The copper alloy contains, 1.5 to 15 mass % Sn, 1.5 to 15 mass % Bi, 1.5 to 20 volume % of a solid lubricant, and balance of Cu and incidental impurities. The volume ratio of Bi to the solid lubricant is in a range of 0.5 to 2.0. Bi and the solid lubricant improves the copper alloy in sintering property, since Bi melts when sintering because of a low melting point resulting in improved sintering property, and the solid lubricant ensures good anti-seizure property, and deterioration of mechanical strength is prevented by virtue of a phenomenon that the solid lubricant is entrained in Bi.