The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2003

Filed:

Apr. 21, 2000
Applicant:
Inventors:

Shinkichi Torii, Kanagawa-ken, JP;

Kouichi Handa, Kanagawa-ken, JP;

Kouji Namiki, Chiba-ken, JP;

Kenji Uesugi, Kanagawa-ken, JP;

Masaaki Suzuki, Kanagawa-ken, JP;

Assignee:

Nissan Motor Co., Ltd., Kanagawa-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28B 1/700 ;
U.S. Cl.
CPC ...
B28B 1/700 ;
Abstract

Seed holes (h) are formed by discharging a pressure medium (G) in a resin body (R) injected in a cavity ( ) of a die (MS1). By expanding the cavity ( ), supplying the pressure medium (G) to the seed holes (h), a size of the resin body (R) is increased, making the seed holes grow, to have a molded resin plate (Vr ) made of the resin body increased in the size and formed with the seed holes grown to internal voids (Vd).


Find Patent Forward Citations

Torii, Shinkichi. (2003). Molded resin plate with internal voids and method and system for manufacturing a molded resin plate (U.S. Patent No. 6602062). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6602062

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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