The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2003
Filed:
May. 17, 2001
Jay DeAvis Baker, Dearborn, MI (US);
Lawrence Leroy Kneisel, Novi, MI (US);
Mohan R. Paruchuri, Canton, MI (US);
Prathap Amervai Reddy, Farmington Hills, MI (US);
Vivek Amir Jairazbhoy, Farmington Hills, MI (US);
Visteon Global Technologies, Inc., Dearborn, MI (US);
Abstract
A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.