The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2003

Filed:

Jul. 06, 1999
Applicant:
Inventors:

Daniel Phillip Dailey, West Bloomfield, MI (US);

Mohan R. Paruchuri, Canton, MI (US);

Prathap Amerwai Reddy, Farmington Hills, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/324 ;
U.S. Cl.
CPC ...
H01R 4/324 ;
Abstract

A method of making an article, such as an electrical connector includes an injection-molded plastic substrate and a pattern of injection-molded metal conductors supported on and mechanically interlocked with the substrate, wherein one of the substrate and the conductors is over-molded onto the other of the substrate and the conductors.


Find Patent Forward Citations

Quick Actions:

Dailey, Daniel. (2003). Multi-shot injection molding process for making electrical connectors and three-dimensional circuits (U.S. Patent No. 6601296). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6601296

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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