The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2003

Filed:

Jun. 30, 2000
Applicant:
Inventors:

Israel Amir, Princeton, NJ (US);

Frank Patrick Higgins, Ewing Township, NJ (US);

Eric Sweetman, Princeton, NJ (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/900 ;
U.S. Cl.
CPC ...
G06F 1/900 ;
Abstract

A circuit board, for use with a high speed backplane, includes transmitter and receiver with circuitry for correcting for multipath signal errors. A training sequence that is often a pseudo-random signal is transmitted by the transmitter on a first circuit board to a receiver located on a second circuit board. The receiver on the second circuit board includes an analog-to-digital signal converter, an equalizer, and a binary digital-to-analog reconverter for receiving the training sequence. The equalizer preferably comprises a series of connected registers having taps in between, a plurality of individual weighting means attached to each of the taps, and a summing means connected to the weighting means. A training sequence is transmitted from the first circuit board to the receiver on the second circuit board, enabling the receiver to adaptively determine a set of weighting means coefficients for correcting the multipath errors in subsequent signals. Coefficients for the weighting means are then adjusted from the output of the summing means. The method and system described can substantially reduce the cost of backplane fabrication and enhance the performance of the overall system.


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