The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2003
Filed:
Jan. 31, 2000
Casio Computer Co., Ltd., Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor substrate having bump electrodes and a sealing film formed thereon, the sealing film having laminated layers. The sealing film interposed between adjacent bump electrodes is prepared by laminating a protective film and each layer of the sealing film on the lower surface of the base film, on the bump electrodes, followed by allowing the bump electrodes to project through the sealing film under pressure and heat. The thickness of the sealing film is smaller than the height of the bump electrode, and thus the bump electrode projects through the sealing film. Particles for lowering the thermal expansion coefficient are dispersed in the sealing film to allow the sealing layers to exhibit a thermal expansion coefficient differing in its thickness direction such that the thermal expansion coefficient in the layer which is close to the semiconductor substrate is close to that of the semiconductor substrate.