The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2003
Filed:
Dec. 08, 2000
Fujitsu Limited, Kawasaki, JP;
Abstract
A mounting substrate and related mounting method for a semiconductor device. The mounting substrate includes a mounting area to which the semiconductor device is to be mounted and fixed by an adhesive, a peripheral channel formed in the mounting substrate so as to surround the mounting area, and radial channels extending radially from the center towards the periphery of the mounting area. An adhesive is applied at least to either the center of the mounting surface of the semiconductor device or the center of the mounting area of the mounting substrate. The semiconductor device is placed on the mounting area and the adhesive flows outwardly along the radial channels, with the adhesive then being cured. The peripheral channel provides control of the amount of adhesive which flows to the outside of the semiconductor device and the mounting area. The adhesive overflow can be adjusted such that adhesive climbs up the sides of the semiconductor device but not reach the upper surface of the device.