The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2003
Filed:
Jan. 11, 2001
Applicant:
Inventors:
Isamu Ohkubo, Kashiba, JP;
Kazuhiro Natsuaki, Sakurai, JP;
Naoki Fukunaga, Soraku-gun, JP;
Masaru Kubo, Kitakatsuragi-gun, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 3/100 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 3/100 ; H01L 2/940 ;
Abstract
A corrosion-resistant conductive layer (TiW layer) formed of a corrosion-resistant material is formed to extend from a bonding pad portion to an interconnection portion of a light receiving element. A semiconductor laser device according to the present invention includes the light receiving element.