The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2003
Filed:
May. 28, 2002
Applicant:
Inventors:
Toshiyuki Nakashima, Nara, JP;
Masahiro Shiota, Souraku-gun, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1445 ;
U.S. Cl.
CPC ...
H01L 2/1445 ;
Abstract
A process of manufacturing a semiconductor device including the steps of: filling a photoresist in a concave portion provided on a surface of a semiconductor substrate; forming a power-feeding thin metal film for electrolytic plating on the semiconductor substrate including a surface of the thus filled photoresist; and forming wiring on the power-feeding thin metal film in a region not above the concave portion by electrolytic plating.