The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2003
Filed:
Nov. 29, 2001
Applicant:
Inventor:
Tomoo Murakami, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/348 ; H01L 2/352 ; H01L 2/940 ; B23K 3/100 ; B23K 3/102 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/348 ; H01L 2/352 ; H01L 2/940 ; B23K 3/100 ; B23K 3/102 ;
Abstract
A flip chip is mounted on a printed circuit board, and bump electrodes and pads are established in electrical connection, wherein sealing resin between the flip chip and the printed circuit board is thermally cured for pressing the bump electrodes against the pads and, thereafter, the bump electrodes are alloyed with the pads so that not only the force but also the alloyed portion keep the electrical connection low in contact resistance without disconnection.