The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2003
Filed:
May. 30, 2001
Applicant:
Inventors:
Assignee:
Altera Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/166 ; H01L 2/352 ; G01R 3/127 ;
U.S. Cl.
CPC ...
H01L 2/166 ; H01L 2/352 ; G01R 3/127 ;
Abstract
A test platform is configured to test a mult-die package having at a first die and a second die. The test platform includes a first lead that is connected to the VCC input on the first die. The test platform also includes a second lead that is connected to VCCIO input on the second die. The VCC input on the second die is connected to ground. The I/O pin of the second die can then be tri-stated using a control circuit disposed between the pre-driver and the driver of the I/O buffer.
Ang, Boon. (2003). Isolation testing scheme for multi-die packages (U.S. Patent No. 6599764). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6599764
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile