The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2003

Filed:

Sep. 25, 2000
Applicant:
Inventors:

Nobuaki Muramatsu, Tamagawa-Mura, JP;

Takahiro Ogawa, Tamagawa-Mura, JP;

Assignee:

Toko Kabushiki Kaisha, Tokyo-To, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/900 ;
U.S. Cl.
CPC ...
H01L 2/900 ;
Abstract

A laminated chip component including: alternately laminated conductive patterns ( ) and insulating sheets ( ); through-holes ( ) which are provided in the insulating sheets and connect top layer conductive patterns to bottom layer conductive patterns; auxiliary conductive patterns ( ) which are provided on the top faces of the conductive patterns at positions facing the through-holes provided in adjacent insulating sheets; and conductors ( ) which are provided in the through-holes. The auxiliary conductive patterns can be substituted by conductor sections ( ) which are provided in the insulating sheets at the positions facing the through-holes provided in adjacent insulating sheets. And, a method for manufacturing a laminated chip component is also disclosed.


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