The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2003
Filed:
May. 17, 2002
Applicant:
Inventors:
Bruce Anthony Copeland, Wappingers Falls, NY (US);
Rebecca Yung Gorrell, Lagrangeville, NY (US);
Mark Anthony Takacs, Poughkeepsie, NY (US);
Kenneth J. Travis, Jr., Newburgh, NY (US);
Jun Wang, Poughkeepsie, NY (US);
Lovell B. Wiggins, Hopewell Junction, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1443 ; H01L 2/1445 ;
U.S. Cl.
CPC ...
H01L 2/1443 ; H01L 2/1445 ;
Abstract
A method of forming a lead-free solder alloy on an electronic substrate. In the method, a metal stack which includes a thick nickel barrier layer and an outer copper layer is then evaporated or plated with silver and tin. Upon heating to an appropriate temperature, the copper, tin and silver form a lead-free tin, silver, copper solder.