The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2003
Filed:
Dec. 07, 2001
Applicant:
Inventors:
Kollengode S. Narayanan, Cupertino, CA (US);
Mohammad Eslamy, Milpitas, CA (US);
Assignee:
Altera Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
The present invention provides a method of forming solder bumps on a semiconductor chip, for flip-chip bonding, having increased height to improve the solder joint reliability of the flip-chip bonded chip and carrier assembly. According to the present invention, a second layer of solder structure is deposited on to each of the solder bump precursor structures formed by a first layer of solder structure to increase the solder-bump volume, which results in solder bumps with increased height.