The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2003
Filed:
Nov. 15, 2001
Noriyuki Takahashi, Yonezawa, JP;
Masayuki Suzuki, Nanyo, JP;
Kouji Tsuchiya, Kaminoyama, JP;
Takao Matsuura, Kawanishi, JP;
Takanori Hashizume, Higashiyamato, JP;
Masahiro Ichitani, Kodaira, JP;
Kazunari Suzuki, Tokyo, JP;
Takafumi Nishita, Iruma, JP;
Kenichi Imura, Higashiyamato, JP;
Takashi Miwa, Fussa, JP;
Other;
Abstract
The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.