The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2003

Filed:

Feb. 11, 2000
Applicant:
Inventors:

Christopher David McCullough, West Yorkshire, GB;

Kevin Barry Ray, Leeds, GB;

Alan Stanley Victor Monk, Cheshire, GB;

John David Riches, West Yorkshire, GB;

Anthony Paul Kitson, West Yorkshire, GB;

Gareth Rhodri Parsons, West Yorkshire, GB;

David Stephen Riley, West Yorkshire, GB;

Peter Andrew Reath Bennett, West Yorkshire, GB;

Richard David Hoare, Stockton-on-Tees, GB;

Assignee:

Kodak Polychrome Graphics, LLC, Norwalk, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03C 1/76 ; G03C 5/00 ;
U.S. Cl.
CPC ...
G03C 1/76 ; G03C 5/00 ;
Abstract

A method of making a mask or an electronic part, for example a printed circuit, comprises the steps of delivering heat in a desired pattern to a precursor of the mask or electronic part, the precursor comprising a surface coated with a coating, the coating comprising a heat-sensitive composition itself comprising an aqueous developer soluble polymeric substance and a compound which reduces the aqueous developer solubility of the polymeric substance, wherein the aqueous developer solubility of the composition is not increased by incident UV radiation but is increased by the delivery of heat; then developing the precursor to remove the heat-sensitive composition in regions to which the heat was delivered. In the case of a printed circuit precursor the surface may be then etched in conventional manner to yield the required printed circuit.


Find Patent Forward Citations

Loading…