The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2003
Filed:
Dec. 20, 2001
Nitto Denko Corporation, Osaka, JP;
Abstract
A wiring board prepreg manufacturing method of the present invention includes the step of depositing and adhering a porous layer made of aromatic polyamide or polyimide onto a heat resistant base material sheet according to a wet gelation process, and the step of impregnating at least one portion of a raw material composition of thermoset resin with insides of pores of the porous layer adhered to the heat resistant base material sheet. Moreover, it is preferable that the step of impregnating the base material composition of the thermoset resin includes the step of applying a raw material liquid of the thermoset resin containing a solvent to a surface of a base material, the step of removing the solvent from the applied raw material liquid so as to obtain a solid coating film, and the step of while heating the solid coating film, laminating and pressurizing the film together with the base material onto the porous layer so as to impregnate at least one portion of the solid coating film.