The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2003
Filed:
Jun. 30, 2000
Applicant:
Inventors:
Assignee:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 ; H01F 1/00 ; H01C 3/00 ; H05K 1/09 ;
U.S. Cl.
CPC ...
H01B 1/22 ; H01F 1/00 ; H01C 3/00 ; H05K 1/09 ;
Abstract
Provided is an electronic material composition which is capable of forming a cured film exhibiting a desired glass transition temperature, a desired stiffness modulus in a rubbery state and a desired extensibility at low temperatures. Also provided is an electronic component comprising a molded body, a packed body, a covering body, an electrode or a joining body, all being formed of the aforementioned electronic material composition. Also provided is a method of using the aforementioned electronic material composition, which is featured in that the electronic material composition is applied in a semi-cured state, and after the application thereof, completely cured.