The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2003

Filed:

Oct. 31, 2000
Applicant:
Inventor:

Masaji Furuta, Hyogo, JP;

Assignee:

Agilent Technologies, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 3/102 ;
U.S. Cl.
CPC ...
G01R 3/102 ;
Abstract

A platform for testing electronic parts and electrode used in the same for easy and accurate testing of a three-terminal device. The platform for testing electronic parts of the present invention includes a press, a DUT (Device Under Test) guide, and an electrode board. The press presses the DUT to the electrode board, maintaining electrical and mechanical contact between the DUT terminals and the electrode groups. The DUT guide holds the DUT as the relative position of the DUT to the electrode board is changed. The electrode board has multiple electrode groups arranged corresponding to terminals of the DUT. The DUT is connected to a test circuit corresponding to each of the electrode groups so that DUT terminals are connected to the corresponding test circuit when the DUT is placed at multiple specific positions on the electrode board. By means of this apparatus, the inductance error component of the electrodes can be extensively removed, while facilitating switching between testings of each terminal of a three-terminal device. Furthermore, by making the surface region of each electrode that contacts the DUT a curved surface, such as a cylindrical or spherical shape, slight elastic deformation will occur at the region that contacts the DUT. As a result, strong surface pressure can be obtained with a relatively small load and contact resistance is stabilized.


Find Patent Forward Citations

Furuta, Masaji. (2003). Apparatus for testing electronic components (U.S. Patent No. 6593762). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6593762

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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