The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2003
Filed:
Jul. 03, 2002
Denso Corporation, Kariya, JP;
Abstract
An electronic device includes two microchips and a bonding layer with which the microchips are bonded together. The bonding layer is a silicone-type adhesive film, which has a glass transition temperature higher than +120° C. or lower than −40° C. Therefore, the influence of the variation in the elastic modulus of the bonding layer due to the glass transition on the electronic characteristic of one of the microchips is substantially eliminated in the temperature range between −40° C. and +120° C. Moreover, the elastic modulus in the temperature range between −40° C. and +120° C. is lowered. Therefore, the influence of a thermal stress in the one of the microchips on the electronic characteristic is suppressed.