The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2003
Filed:
Nov. 28, 2000
Applicant:
Inventor:
Joseph E. Page, Mechanicsville, VA (US);
Assignee:
Infineon Technologies, North America Corp, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1302 ; C23F 1/00 ; B24B 1/00 ; B24B 7/19 ; B24B 7/30 ; B24B 2/900 ; B24B 5/00 ;
U.S. Cl.
CPC ...
H01L 2/1302 ; C23F 1/00 ; B24B 1/00 ; B24B 7/19 ; B24B 7/30 ; B24B 2/900 ; B24B 5/00 ;
Abstract
A method for polishing a semiconductor wafer includes providing a semiconductor wafer having topographical features and forming a dielectric layer on the semiconductor wafer to fill portions between the features. The dielectric layer is planarized across the entire semiconductor wafer for a first portion of a polishing process. The dielectric layer is polished for bulk removal of the dielectric layer for a remaining portion of the polishing process.