The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2003

Filed:

Aug. 11, 2000
Applicant:
Inventor:

Masahiko Fujisawa, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/120 ; H01L 2/136 ; H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/120 ; H01L 2/136 ; H01L 2/144 ;
Abstract

A semiconductor device with low contact resistance which can cope with the miniaturization of semiconductor devices as well as a manufacturing method thereof which is easy and inexpensive can be obtained. Impurity regions on an Si substrate, an interlayer insulation film, source and drain interconnections, a metal silicide layer larger in diameter than the lower edge of the contact holes around the impurity regions are provided and the metal silicide layer includes an interface making up a border between the upper metal silicide layer contacting with the bottom of the interlayer insulation film and the lower metal silicide layer contacting with the impurity region surface. Thus, the contact area between the source and drain lines and the impurity regions can be increased via the metal silicide layer so as to reduce the contact resistance.


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