The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2003
Filed:
Oct. 29, 2002
Kazunori Kanamori, Sodegaura, JP;
Shigeki Kishiro, Ichihara, JP;
Sumitomo Chemical Company, Limited, Osaka, JP;
Abstract
A polypropylene resin composition comprising 100 parts by weight of a polypropylene resin (A) having a die swell ratio of less than about 1.70 and about 0.01 to about 45 parts by weight of a polypropylene resin (B) having a die swell ratio of about 1.80 or more. A T die film is also provided, composing polypropylene wherein the film has a molecular weight distribution of about 4.2 or less and a die swell ratio of 1.28 or more. A method of producing a T die film is also provided, comprising the steps of melt-kneading polypropylene by an extruder, extruding the melted product through a die lip, and cool-solidifying the extruded material by a cooling roll to form a film. The film resulting by this method has a molecular weight distribution about of 4.2 or less and a die swell ratio of about 1.28 or more. Further, the present invention provides a laminated molded body comprising a heat molded body composed of a polypropylene resin composition containing 100 parts by weight of polypropylene resin (A), about 0.01 to about 45 parts by weight of a polypropylene resin (B) and a substrate comprising a thermoplastic resin.